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Physical Properties
Material: Celazole PolyBenzImidazole
A high performance imidized thermoplastic.

This specification covers a new material used in the manufacture of Tecknit interconnection sockets.

Celazole Capabilities:

Below are Typical Applications provided by the manufacturer.
1. Wafer retaining rings for gas plasma etching.
2. Vacuum tips.
3. Wafer carriers.
4. Contact seals.
5. Insulator bushings.
6. Thermal isolators.
7. Guide rollers.
General Properties as provided by manufacturer.
Celazole PBI is the highest performing engineering plastic currently
available. It offers the highest heat resistance and mechanical property
retention over 400°F (205°C) of any unfilled
plastic. It has better wear resistance and load carrying capabilities
at extreme temperatures than any other reinforced or unreinforced
engineering plastic. As an unreinforced material, Celazole PBI is very
clean in terms of ionic impurity and does not outgass (except water).
These characteristics make this material very attractive to semiconductor
manufacturers for vacuum chamber applications. Celazole PBI has excellent
ultrasonic transparency which makes it an ideal choice for parts such as
probe tip lenses in ultrasonic measuring equipment.
Celazole PBI is also an excellent thermal insulator. Other plastics in melt
do not stick to PBI. These characteristics make it ideal for contact seals
and insulator bushings in plastic production and molding equipment.

Physical Properties as provided by manufacturer:
Please refer to the chart below for the material specifications.
Celazole PBI
Physical Properties ASTM or UL test method Celazole PBI
Density (lb/in3)
(g/cm3)
D792 0.047
1.30
Water Absorption, 24 hrs (%) D570 0.40
Machanical Properties ASTM or UL test method Celazole PBI
Tensile Strength (psi) D638 23,000
Tensile Modulus (psi) D638 850,000
Tensile Elongation at break (%) D638 3.0
Flexural Strength (psi) D790 32,000
Flexural Modulus (psi) D790 950,000
Compressive Strength (psi) D695 50,000
Compressive Modulus (psi) D695 900,000
Hardness, Rockwell D785 E105
IZOD Notched Impact (ft-lb/in) D256 0.5
Thermal ASTM or UL test method Celazole PBI
Coefficient of Linear Thermal Expansion
(x 10-5 in./in./ °F)
D696 1.3
Heat Deflection Temp. (°F / °C)
at 264 psi
D648 800 / 427
Glass Transition Temperature (°F / °C) D3418 750 / 399
Max Operating Temp (°F / °C) - 650 / 343
Thermal Conductivity
(BTU-in/ft2-hr-°F)
(x 10-4 cal/cm-sec-°C)
C177 2.80
9.64
Flammability Rating UL94 V-O
Electrical ASTM or UL test method Celazole PBI
Dielectric Strength (V/mil) short time, 1/8" thick D149 550
Dielectric Constant at 1 MHz D150 4.20
Dissipation Factor at 1 MHz D150 -
Volume Resistivity (ohm-cm) at 50% RH D257 >1013

Please Read
The information contained herein are typical values intended for
reference and comparison purposes only. They should NOT be used
as a basis for design specifications or quality control.
All values at 73°F (23°C) unless otherwise noted.
Contact www.boedeker.com for manufacturers complete material
property datasheets. Or call toll free at 1-800-444-3485.
For all other information contact TECKNIT Sales and Marketing Manager.